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Niladri Banerjee

Director, Wafer-level 3d Process Integration @Intel

Portland, OR, US
EMAILS
n••••••••@intel.com
MOBILE NUMBERS
+19•••••••29

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WORK HISTORY

Jul 2024 — Present

Director, Wafer-level 3d Process Integration @Intel

EDUCATION

2007 — 2011

West Bengal University of Technology

Bachelor's Degree

2012 — 2014

University of Utah

Master’s Degree

2012 — 2015

University of Utah

Doctor of Philosophy (Ph.D.)

SKILLS

Wire BondingFibE-Beam EvaporationLithographyWafer BondingInjection MoldingThin FilmsWet Chemical EtchingOpticsSolid State PhysicsSemiconductor ProcessCharacterizationSpectroscopyAtomic Layer DepositionSemiconductor IndustryEllipsometryEdxActuatorsMicrofabricationMicrofluidicsPolymer CharacterizationSensorsMemsNemsReactive Ion EtchingSemNanotechnologySputtering

ABOUT NILADRI BANERJEE

Steering pioneering efforts in wafer-level 3D process integration at Intel Corporation…

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