Sriram Vangal

Amd Fellow, Ieee Fellow @AMD

Portland, OR, US
EMAILS
s••••••••@amd.com
MOBILE NUMBERS
+15•••••••36

Signup · Get unlimited contacts

WORK HISTORY

Dec 2024 — Present

Amd Fellow, Ieee Fellow @AMD

San Jose, CA, US

EDUCATION

1993 — 1995

University of Nebraska-Lincoln

MS, Computer Engineering

2003 — 2007

Linköping University

PhD, Low-power VLSI Design, NoC

1989 — 1993

Bangalore University

B.E, Electronics Engineering

SKILLS

Application-Specific Integrated Circuits (Asic)Research and DevelopmentVerilogTechnical LeadershipR&DSiliconResearchSemiconductorsLow-Power DesignCmosSignal ProcessingSocHigh Performance ComputingCircuit DesignFormal VerificationIcEmbedded SystemsComputer ArchitectureVlsiPower ManagementSimulationsFpgaAsicIntegrated Circuit DesignMicroprocessorsDigital Signal ProcessorsAnalog Circuit Design

ABOUT SRIRAM VANGAL

Professional, innovative, results-oriented leader and accomplished VLSI technologist with 20+ years of combined product and R&D experience. Routinely embrace new and challenging assignments. Extensive experience leading R&D development and silicon execution across global cross-functional teams and driving corporate-level strategic initiatives. Responsible for several generations of advanced silicon R&D at Intel Labs; spanning 13+ process technology nodes, leading large teams (75+) with breakthrough results and impact to multiple Intel product lines. On a quest to genuinely realize energy autonomy in VLSI designs/products by empowering ultra-low power, energy-efficient computing.Skills: HPC, Many-core CPU & minimum-energy SoC architectures, Ultra-low power, energy-efficient silicon design, Design technology co-optimization (DTCO), Fine-grained silicon clocking & power management expertise, Embedded-AI, Tiny-ML and security hardware circuits, Deep nano-meter VLSI design expertise (RTL ⇒ GDS), Green Near-threshold voltage (NTV) computing expertise, Experience setting up and leading offshore team(s), Consistent, pioneering 20+ year R&D track record, Management experience, Excellent team player, communication and interpersonal skills, Solid research-to-product impact, 50+ papers, 50+ patents, Senior memberAwards: Two-time Intel Achievement award and Gordon Moore awards

This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.