Shravana Katakam
Wafer Level Process Integration Engineer @IBM
Clifton Park, NY, US
EMAILS
s•••••••@ibm.com
MOBILE NUMBERS
+19•••••••26
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WORK HISTORY
Oct 2024 — Present
Wafer Level Process Integration Engineer @IBM
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Albany, NY, US
EDUCATION
2006 — 2010
National Institute of Technology Raipur
Bachelor of Technology (B.Tech.), Materials Engineering
2010 — 2014
University of North Texas
Doctor of Philosophy (Ph.D.), Materials Engineering
SKILLS
Process EngineeringTemLaser ProcessingMechanical TestingLaserNanomaterialsMetallurgyOriginlabSpcMicrosoft OfficeThin FilmsNanotechnologySemOptical MicroscopyTgaFocused Ion Beam (Fib)CharacterizationWearSemiconductorsPhase TransformationScanning Electron MicroscopyEdxNanocompositesMicro-XrdMetallic GlassesPowder X-Ray DiffractionLeap (Local Electrode Atom Probe)Process ImprovementDesign of ExperimentsExperimentationManufacturingHeat TransferCorrosionMicrosoft ExcelMetallographyMagneticsFibXpsMaterialsJmp
ABOUT SHRAVANA KATAKAM
Summary-1year experience as wafer level process integration engineer working on 2.5D…
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