Peeyush P. Awasthi
Research Scientist, Packaging Lab @Florida International University - College Of Engineering & Computing
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WORK HISTORY
Research Scientist, Packaging Lab @Florida International University - College Of Engineering & Computing
Miami, FL, US
Designed an AI-embedded RF-based Inline Monitoring System (multi-port) for defect detection in the large-scale packaging substrates/PCBs (patent awarded:US12••••50B1) Designed non-contact smart probes that detect interlayer defects (delamination, misalignment, warpage) with real-time monitoring capability for manufacturing yield optimization. Conducted a detailed analysis to find/select the suitable topology, material, and design of a sensor for an Augmented Smart Glove required in ja-BCI (joint-angle Brain Computer Interface). Developed a smart millimeter-Wave Antenna (mWA) coupled with a machine learning algorithm to monitor bending for sub-degree resolution. This sensor can be used for failure detection/Augmented Smart Glove in ja-BCI. Contributed to NSF-funded project on precision monitoring in electronics manufacturing (NSF Grant 22•••94).
EDUCATION
IIT Kanpur
Master of Technology (M.Tech.)
Florida International University - College of Engineering & Computing
Master's degree
Florida International University - College of Engineering & Computing
Doctor of Philosophy - PhD
Indian Military Academy
Military Service Training
National Defense Academy
Bachelor's degree
Military College of Electronics and Mechanical Engineering
Bachelor of Technology - BTech
ABOUT PEEYUSH P. AWASTHI
Systems engineer and a veteran with years of experience in military engineering…
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