Mike Trowill

WORK HISTORY

SKILLS

ABOUT MIKE TROWILL

PCB Design Extensive experience of PCB layout, Schematic capture and Component Part Creation: PCB Footprint and Schematic Symbols, Mapping files containing Pin Definitions and pin swapping data etc.The creation of Bare Board Manufacturing Data Packs, such as Gerber Files, Drill Files, Fabrication drawings, Step and Repeat Panels.The Creation of Board Assembly Drawings, BOM generation and Pick and Place data. Design input on Projects from their conception to completion, assistance in the specification of Laminates, Board Stack-Ups, Via Technology, and PCB Finish.Working in close collaboration with Electronic, RF, Mechanical and Test engineers in order to ensure the design meets the required specification. EMC Compliance ESD / EMI Control The correct design of PCBs to pass ESD / EMC compliance testing. Planning the scheme of the PCB from the outset to meet EMC Compliance, with a good Grounding concept etc.IPC Design Standards - design of PCBs to IPC Class 3.For high reliability applications, such as Defence, Medical and Automotive.High Speed Impedance Controlled design Impedance controlled layout of DDR, SPI, LVDS, USB2/3, Gigabit Ethernet etc. 50 Ohm single ended and 90/100 Ohm differential pairs. Matched delay routing, terminator placement etc.Use of CAD System constraints tools to control the high-speed design requirement of the layout to ensure timing constraints are met. HDI Design (high density interconnect) Multi-layer (14 + layer) HDI designs, 60-micron track and gap 220-micron micro vias + buried PTH.Chip scale packages, 0.4mm pitch BGAs etc. with high speed interconnect, requiring impedance controlled stackups.Dense Component placement utilising both side of the board.RF Layout The design of RF elements for Mobile Phones, Modems and Base stations. The use of RF layout Techniques, such as the correct placement of components along the transmission line, placing components in serial fashion and not branching off the transmission line. The use of Micro Strip and Strip Line.The importance of a Solid Ground Planes, the need to control the Impedance of RF connections and the use of RF Shielding and correct component placement to avoid coupling etc.The Correct Stackup construction to meet the Impedance/Power requirements for the Transmission lines.CAD System AdministrationThe Installation of networked CAD systems, including sever setup for license, library management and client machine configuration.The installation and maintenance of networked Database libraries, such as CIP/CIS for OrCAD.