Kenzie Feeney Hoffman

Packaging Engineer @MìLà

Detroit, MI, US
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Mar 2022 — Present

Packaging Engineer @MìLà

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Leading all structural packaging design for direct to consumer, retail and club store Frozen Chinese food. • Connecting cross functionally daily to communicate timelines, pricing, and project updates. • Standardizing packaging throughout 4 logistics partners and 2 XCJ facilities. • Researching new and exciting packaging designs and trends to implement, to increase customer loyalty and encourage reordering. • Troubleshooting cold chain quality issues to combat melting orders without vastly increasing spend.

EDUCATION

2013 — 2017

Michigan State University

Bachelor of Science - BS, Packaging

2009 — 2013

Traverse City St. Francis High School

High School Diploma

ABOUT KENZIE FEENEY HOFFMAN

Experienced Packaging Engineer with a demonstrated history of working in the food production and rigid plastic industry. Strong professional skilled in CAPE/TOPS, Microsoft Office, SAP, Teamwork, and Leadership.

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Kenzie Feeney Hoffman — Packaging Engineer at MìLà in Detroit, MI, US | Unifers