Kangguo Cheng

Senior Technical Staff Member @IBM

2019 – present, Hardware-based Artificial Intelligence (AI) research, IBM, Albany, NY - Responsible for exploring hardware-based AI technologies including fundamental materials, device architectures for potential AI applications. • 2012 – 2018, Technical Lead of advanced CMOS semiconductor technology, IBM, Albany, NY - Responsible for technical aspects of advanced CMOS technology to explore, define, and drive semiconductor device architectures including FinFET and emerging device architectures. Working with multiple teams from a variety of R&D alliance (IBM, Samsung, GLOBALFOUNDRIES) to identify and solve critical technology issues to meet technology specifications and milestones. • 2007 – 2012, Lead Engineer, IBM, Albany, NY - As the Lead Integrator, led a team and successfully developed the world-class fully depleted SOI (FDSOI) technology for low-power and high performance applications. • 2001 – 2007, Development Engineer, IBM Semiconductor Research and Development Center, Microelectronics, East Fishkill, NY - Responsible for innovating, developing, and implementing embedded memory technology in IBM’s first 45nm high performance SOI microprocessors with on-chip embedded memory (eDRAM) which becomes a key performance booster for IBM’s high performance server chips of 45nm, 32nm, 22nm, 14nm. Initiated heavily doped SOI substrates in 2006 and the new substrates have been used in manufacturing high performance 22nm and 14nm high-performance chips with on-chip eDRAM- Also responsible for developing and transferring 110nm, 90nm, 65nm DRAM and eDRAM to manufacturing. Job role: semiconductor process integration.