Asa Diskin

Senior Sales Executive @OptiCool

Chicago, IL, US
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Aug 2025 — Present

Senior Sales Executive @OptiCool

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Webster, NY, US

As Senior Sales Executive at OptiCool Technologies, Asa manages technical sales, channel partnerships, and business development for OptiCool\'s portfolio of liquid cooling data center solutions. OptiCool two-phase rear door heat extractors enable high-density AI compute while reducing capital expenditure, PUE, total cost of ownership, energy consumption and carbon footprint up to 90%.

EDUCATION

2011 — 2016

Ohio Wesleyan University

Bachelor of Arts (B.A.), Economics

2016 — 2017

University of Cincinnati Carl H. Lindner College of Business

Graduate Certificate, Data Analytics

2010 — 2011

Miami University

PSEO Program, Economics/Philosophy

2015 — 2015

Earlham College

Bachelors of Arts, Economics

SKILLS

International BusinessHigher EducationSupply Chain ManagementStatistical Data AnalysisFundraisingMarketing StrategyEconomicsPublic SpeakingCustomer ServiceTeachingManagementAccountingData AnalysisMicrosoft OfficeMicrosoft WordResearchEditingLogistics ManagementStudent AffairsCritical ThinkingNon-ProfitsSocial MediaEvent PlanningLeadershipPowerpointMicrosoft Excel

ABOUT ASA DISKIN

Asa is an experienced Technical Sales Executive focusing on new business development, GTM strategy, channel enablement, and new product development. As Senior Sales Executive at OptiCool Technologies, Asa engineers two-phase liquid cooling technology solutions for the data center industry; driving revenue per kW and enabling AI, while reducing capital expenditures, energy usage, total cost of ownership, and carbon footprint.Through his engagement with the Open Compute Project (OCP) and the broader data center community, Asa works to advance the adoption of high-density, liquid-cooling infrastructure. Asa\'s involvement focuses on collaborating with hyperscalers, colocation providers, OEMs, engineering firms, standardization bodies, and channel partners to accelerate the shift toward more efficient, scalable cooling architectures for AI and HPC workloads.

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