Ariana Kouloungis

Marketing Coordinator @Finetech

Amherst, NH, US

Finetech’s high‐accuracy die bonding equipment supports the most precise & complex applications in advanced packaging, die attach and micro assembly. Sub-micron placement is possible with an extensive range of bonding technologies including thermo-compression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, Indium. Finetech follows the “Prototype-to-Production” approach to support customers at the development stage and help them transition their processes into production.As the Marketing Coordinator, my role is dynamic and requires multitasking, creativity, attention to detail, and the ability to work collaboratively with other departments to achieve marketing goals.

Assumption University

Marketing

Chelmsford High School

High School Diploma