Zijie
Packaging Engineer @Broadcom
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WORK HISTORY
Packaging Engineer @Broadcom
Irvine, CA, US
Product ownership over the entire life cycle of new product development from prototype design, initial bring-up, qualification to full mass production launch; Vendor/supplier management, establishment of product packaging assembly and process control requirements; Providing failure analysis and proposing solutions to package related issues; Collaboration with cross functioning teams including product engineering, test engineering, BU and hardware engineering.Hands on design experiences in flipchip, wirebond, BGA, QFN, proficient in APD; Design automation, design optimization and standardization; Material characterization, package technology/process development and qualification, failure analysis; Thermal/SI/Mechanical analysis for various types of IC packages.Proposed substrate design guidelines for 10+ critical IP blocks;Designed 1st BRCM’s device using coreless substrate for broadband application;Set up the package qualification by similarity database to achieve significant engineering cost saving; packaging lead for automotive/broadband applications.
EDUCATION
Auburn University
M.S
Auburn University
Ph.D
SKILLS
ABOUT ZIJIE
Specialties: package design, SI/mechanical analysis, Materials Characterization, DOE, Data Analysis, Failure Anaylsis
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