Zijie

About Zijie

Specialties: package design, SI/mechanical analysis, Materials Characterization, DOE, Data Analysis, Failure Anaylsis

Experience

1. Packaging Engineer

   Broadcom

   Nov 2012 — Present · Irvine, CA, US

   Product ownership over the entire life cycle of new product development from prototype design, initial bring-up, qualification to full mass production launch; Vendor/supplier management, establishment of product packaging assembly and process control requirements; Providing failure analysis and proposing solutions to package related issues; Collaboration with cross functioning teams including product engineering, test engineering, BU and hardware engineering.Hands on design experiences in flipchip, wirebond, BGA, QFN, proficient in APD; Design automation, design optimization and standardization; Material characterization, package technology/process development and qualification, failure analysis; Thermal/SI/Mechanical analysis for various types of IC packages.Proposed substrate design guidelines for 10+ critical IP blocks;Designed 1st BRCM’s device using coreless substrate for broadband application;Set up the package qualification by similarity database to achieve significant engineering cost saving; packaging lead for automotive/broadband applications.

Education

• Auburn University

  M.S

  2008 — 2011

• Auburn University

  Ph.D

  2006 — 2012

Skills

• Electronics
• Photolithography
• Data Analysis
• Materials Science
• Failure Analysis
• Microfabrication
• Scanning Electron Microscopy
• Powder X-Ray Diffraction
• Differential Scanning Calorimetry
• Semiconductors
• Packaging
• Modeling and Simulation
• Design of Experiments
• Manufacturing
• Materials
• Finite Element Analysis
• Nanotechnology
• Dsc
• Sem
• Tem
• Mems
• Mechanical Engineering
• Afm
• Engineering
• Matlab
• Jmp
• Testing
• R&D
• Sputtering
• Reliability
• Characterization
• Thin Films
• Simulations
• Xrd
• Labview