Zhi Li
TD Engineer @ Intel | Semiconductor Fabrication
- Role
- Process Integration Td Engineer Advanced Packaging at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Zhi Li
Semiconductor R&D Senior Engineering with 9+ yrs of hands-on experience in development…
Experience
Process Integration Td Engineer Advanced Packaging
Oct 2022 — Present · Hillsboro, OR, US
Education
Columbia Engineering
Master's degree, Chemical Engineering
2009 — 2011
University of Florida
Ph.D., Chemical Engineering
2011 — 2015
Shanghai Yan'an High School
Associate Diploma, General Studies
2002 — 2005
East China University of Science and Technology
Bachelor's degree, Chemical Engineering
2002 — 2009
Technische Hochschule Lübeck
Diplom(FH)-Ing, Environmental Engineering
2008 — 2009
Skills
- Atomic Layer Deposition
- Chemical Engineering
- Scanning Electron Microscopy
- Matlab
- Powder X-Ray Diffraction
- Uv/Vis
- Semiconductors
- Characterization
- Afm
- Nanotechnology
- Thin Films
- Electrochemistry
- Materials Science
- Spectroscopy
- Ni Labview
- Thermodynamics
- Ir
- Photovoltaics
- Tem
- Nanoparticles
- Surface Chemistry
- Rapid Thermal Annealing
- Organic Chemistry
- Sputtering
- Solar Cells
- Reflectometery
- Ellipsometry
- E-Beam Evaporation
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