Zhi Yang
Silicon-PKG-System Co- Optimization
- Role
- Sr Director of Packaging at NVIDIA
- Location
- New York, NY, US
- LinkedIn followers
- 500 followers
About Zhi Yang
Cross-discipline background in thermal science and mechanical engineering in both experimental and numerical simulation with focus on electronic packaging; Drive chip- package - system co-design with emphasis on Perf/ TCO; Lead assembly process aware design and multi-physics numerical simulation effort to achieve global optimal packaging design10+ years of experience in packaging design and optimization; 5 US patents; 100+ peer-reviewed journal publications in thermal management/ electronics packaging co-optimization with google citations. Journal editor for Microelectronics and Electronic Packaging, committee member for IMAPS/ ECTC
Experience
Sr Director of Packaging
Dec 2025 — Present · New York, NY, US
Education
University of Maryland
Doctor of Philosophy (Ph.D.), Thermal Science, Heat Transfer, Mechanical Engineering
Dalian University of Technology
Bachelor of Engineering (B.E.), Thermal Science
Skills
- Physics
- Hands on Machining
- Numerical Simulation
- Labview
- Optimization
- Microsoft Office
- Ansys-Icepak
- Finite Element Analysis
- Data Analysis
- Matlab
- Microsoft Word
- Electronics Cooling
- Heat Transfer
- Thermal Management
- Laser-Ir Camera Expertise
- Gradient Coil Static Magnetic Field
- Simulations
- Numerical Analysis
- Solidworks
- Engineering
- Autocad
- Statistics
- 3d Printing Technology
- Latex
- Ansys Workbench/ Apdl
- Research
- Ansys
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