Yulian Yao

Process Engineer @Applied Materials

Santa Clara, CA, US
EMAILS
y••••••••@amat.com
MOBILE NUMBERS
+14•••••••38

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WORK HISTORY

Jan 2021 — Present

Process Engineer @Applied Materials

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Santa Clara County, CA, US

Characterize PECVD deposited SiOx and SiNx thin films and stacks (RI, stress, roughness, non-uniformity, TEM, VBD, defects)-Develop new processes and explore new materials for 3D NAND stack to address customer’s high value problems-Participate in customer meetings to understand system level issues, troubleshoot down to component/processlevel and provide solutions to customer-Collaborate with electric/mechanical team in the design of hardware and responsible for design verification-Translate customer’s request to software team and collaborate with them in software test and on wafer verification

EDUCATION

2012 — 2016

Shanghai Jiao Tong University

Bachelor's degree

2016 — 2020

Georgia Institute of Technology

Doctor of Philosophy - PhD

ABOUT YULIAN YAO

As a Process Engineer at Applied Materials, I leverage my PhD in Materials Science and Engineering and my PECVD expertise to develop new processes and explore new materials for 3D NAND stack. I work closely with customers to understand their system-level issues, troubleshoot them down to component or process level, and provide solutions that address their high-value problems.I also collaborate with the electric, mechanical, and software teams in the design, verification, and testing of hardware and software components for PECVD systems. I have extensive cleanroom experience in CSD, photolithography, metal sputtering, and etching, as well as analysis experience in XRD, SEM with EDS, XPS, AFM, and piezoelectric and ferroelectric testing. My research focus at Georgia Institute of Technology was on the fabrication and characterization of ferroelectric and antiferroelectric thin films for energy storage and actuation applications, where I obtained a MEMS certificate and published multiple papers in Advanced Materials, Nanoscale, etc.

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