Yujun Li

About Yujun Li

Now leading Microsoft\'s silicon and advanced packaging teams supporting all custom products (internal designs and semi-custom). Grew TSMC\'s HPC business from less than 10% to over 50% of company\'s growing revenue over ten-year horizon, through strategic customer engagement and optimized technology offerings.Yujun was with IBM for 20 years in various management and engineering positions, in semiconductor R&D, systems group, and corporate strategy group respectively.50+ published papers and invited talks, 20+ issued patentsInvited talks and panelist at International Solid State Circuit Conference Forum, International VLSI Symposium, VLSI-TSA, Semicon Taiwan, IMPACT Taiwan, NEPCON Japan, etc. Plenary Talk: https://tinyurl.com/y6s96n4c Interview by inside HPC: Paul Rappaport Award, IBM Master Inventor, IBM Lou Gerstner Client Advocate Award.

Experience

1. Partner, Silicon and Advanced Packaging

   Microsoft

   Jan 2026 — Present · Hillsboro, OR, US

Education

• Yale University

  Ph. D, M. Phil., M.S., Electrical Engineering

  1992 — 1997

• MIT Sloan Executive Education

  Artificial Intelligence: Implications for Business Strategy

• University of Science and Technology of China

  B.S., Physics

  1988 — 1992

Skills

• Integration
• Semiconductor Industry
• Semiconductors
• Ic
• Analysis
• Technology Development
• IT Strategy
• Strategic Partnerships
• Program Management
• Strategy
• Cloud Computing
• Business Strategy
• Cross-Functional Team Leadership
• Process Engineering
• Enterprise Software
• Go-to-Market Strategy
• Characterization
• Product Management
• Processors
• Integrated Circuits (Ic)
• Management