Yuan Wang

About Yuan Wang

Process control of multiple key layers in a 24x7 wafer-level magnetic recording head…

Experience

1. Principal Process Engineer

   WD

   Nov 2017 — Present · San Francisco, CA, US

   1) Overseen CMP key layers process control, wafer disposition, CMP tools maintenance and troubleshooting, defective wafer failure analysis• All owned CMP key layers CpK & Ppk more than 1.33 with increased trend: JMP statistical data analysis, SPC chart setup and monitor, APC (automation process control) optimization, wafer integration knowledge built up, process tool trouble shooting. • Monitored process of wafer manufacturing in coordination with various multi-functional technical teams, including manufacturing, equipment engineering, process engineering, vendors, and development.(2) Performed existing CMP process optimization, continuous yield improvement, cycle time and cost reduction. • Targeted statistical parameters (e.g, SPC, CpK, PpK) and quantities (i.e, throughput) while seeking to improve CMP processes. • Applied continuous improvement methods such as lean manufacturing, APC (automation process control), continuously refines process recipe & metrology recipe to avoid manual delays and reduce wafer process time & cost.• Prepared reports summarizing information and trends related to manufacturing performance.(3) Lead new CMP technology/design development, introduction, qualification, and production ramp up• Worked closely with Integration and Research & Development teams to evaluate, set up, and launch new products and CMP processes.• Conducts design of experiment (DOE) to setup and optimize new product CMP process recipe, APC control system, CRMs, metrology recipe, etc.• Consulting manufacturing teams and equipment vendors in evaluating and, if needed, improving certain CMP tools and functions

Education

• RWTH Aachen University

  Master's degree, Physical Metallurgy and Metal Physics

  2008 — 2011

• University of California, Riverside

  Doctor of Philosophy - PhD, Materials Science and Engineering

  2012 — 2016

• University of Science and Technology Beijing

  Bachelor's degree, Materials Science and Engineering

  2004 — 2008

Skills

• Management
• Data Analysis
• Research
• Microsoft Excel
• Microsoft Office
• Engineering
• Research and Development (R&D)
• Public Speaking
• Microsoft Powerpoint
• Sem
• Eds
• Tem
• Xrd
• Tga
• Bet
• Uv/Vis Spectroscopy
• Ftir
• Raman Spectroscopy
• Xps
• Icp
• Elemental Analysis
• Electrochemical Characterization
• Eletrochemical Workstation
• Powder X-Ray Diffraction
• Electrophotocatalysis
• Semiconductors
• Crystal Engineering
• Photocatalysis
• Metal Organic Frameworks
• Nanomaterials
• Quantum Dots
• Chemical Vapor Deposition (Cvd)
• Electrodeposition