Yong Liu
Senior Director Principal Member of Tech Staff, Ieee Fellow @onsemi
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WORK HISTORY
Senior Director Principal Member of Tech Staff, Ieee Fellow @onsemi
South Portland, ME, US
Leader of modeling and analysis team of global ON Semiconductor for advanced analog, image sensor, and high power solution, design optimization and quantitative analysis, customer quality/reliability/failure analysis and assembly manufacturing process. Products include various analog WLCSPs, Automotive Power Module and High Power Module(including SiC module for EV/HEV and dual side cooling high power module), and image sensor for automotive application. Granted 20 US patents and filed more than 10 US patents for SiC, high power module including dual side cooling module and image sensor. Gave several invited talks, keynotes and short courses for conferences and industry. Won ON Semiconductor Corporate Innovation Champion for HEV Inverter Challenges, 2019. Supporting ON Semiconductor new product release of dual side cooling high power module VE-Trac. Business Wire (Dec 16, 2019) reported this new product release “first devices on platforms from new VE-Trac™ family offer market-leading electrical and thermal performance backed by market-ready capacity and expanded supply chain”. Contributed the simulation optimization for ON Semiconductor\'s SiC product release in December 2019, the work successfully made the SiC product pass the industry reliability test. Won 2021 EPS Electronics Manufacturing Technology Award.Won 2024 onsemi Recognition: Remarkable Achievements and Exceptional Contribution
EDUCATION
University of Cambridge
Material engineering and applied mechanics
Technische Universität Braunschweig
Applied mechanics and computational mechanics
Nanjing University of Science and Technology
Mechanical Engineering, MEMS and precise mechanical and electronic device.
SKILLS
ABOUT YONG LIU
Specialties: Advanced analog IC and power electronic packaging (from LV to high power applications)Modeling and simulation for electrical, thermal and mechanical analysis, optimization, quantitative analysis, quality, reliability and failure analysis, Fab and packaging assembly manufacture process. Granted 65US Patents in analog, power electronic packaging and device, high power module, and over 10 pending US patents. Published 4 Books, 3 book chapters and over 180 tech papers in journals and conferences.
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