Yingying Zhang
Packaging R&D Engineer at Intel
- Role
- Packaging Research and Development Engineer at Intel
- Location
- Chandler, AZ, US
- LinkedIn followers
- 500 followers
About Yingying Zhang
7+ years of experience in thermal characterization and material structural design • 4+ years of experience in ultrafast pump-probe optical measurements and cleanroom technology• Perform model analysis and simulations using MATLAB and FORTRAN code• Experience of FEA simulations using ANSYS to study the thermal field of Czochralski process to grow sapphire• Knowledge of the 3D modeling software such as SolidWorks and AutoCAD
Experience
Packaging Research and Development Engineer
Jan 2023 — Present · AZ, US
Education
Huazhong University of Science and Technology
Master's degree, Engineering of Thermophysics
2014 — 2017
University of Minnesota
Doctor of Philosophy - PhD, Mechanical Engineering
2017 — 2022
Huazhong University of Science and Technology
Bachelor's degree, Nuclear Engineering and Technology
2010 — 2014
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