Yi He
Sr. Staff Engineer at Intel
- Role
- Sr Packaging Engineer Staff Engineer Sr Staff Engineer Technologist at Intel
- Location
- Chandler, AZ, US
- LinkedIn followers
- 500 followers
Experience
Sr Packaging Engineer Staff Engineer Sr Staff Engineer Technologist
May 1997 — Present · Chandler, AZ, US
Expertise in the characterization of electronic packaging materials at Intel. Extensive experience in problem-solving with thermal analysis techniques, including DSC, DMA, TMA, DEA, TGA, Hot Disk (thermal conductivity), Sorption TGA, and DMA-RH. Conducted extensive studies to determine the cure behavior, thermal expansion, viscoelastic properties, moisture absorption and diffusion, and hygroscopic swelling behavior of electronic packaging materials, including underfills, mold compounds, thermal interface materials, solder resists, dielectric films, substrate cores, die-attach materials, sealants, solder alloys, and glass core-related materials. My effort helped materials pathfinding, qualification, and selection activities across Intel for multi-generations of products, and supported package warpage modeling. Specialized in characterizing alpha emissivity of electronic packaging materials to support soft error rate modeling. Reviewer for a number of journals, including Thermochimica Acta, Microelectronics Reliability, Journal of Calorimetry and Thermal Analysis, International Journal of Thermal Sciences, Materials Letters, Journal of Alloys and Compounds, Journal of Sensors, European Polymer Journal, etc. Extensive internal and external publications in the area of electronic packaging materials characterization.
Skills
- Materials
- Resonant Ultrasound Spectroscopy
- Moiture Absorption
- Jmp
- Intel
- Materials Science
- Physics
- Testing
- Hygroscopic Swelling
- Electronics Packaging
- Dma
- Failure Analysis
- Thin Films
- Tma
- Differential Scanning Calorimetry
- Design of Experiments
- Moisture Properties
- Soft Error
- Tga
- Semiconductors
- Thermal Analysis
- Dsc
- Thermal
- R&D
- Engineering
- Alpha Emission
- Time Temperature Superposition
- Spectroscopy
- Characterization
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