Yashneil Sawjiani

About Yashneil Sawjiani

Hi, I’m Yashneil - a product management professional with a background in Industrial Engineering and a focus on the hardware infrastructure powering AI/ML, Data Center and Networking applications.Currently, I operate at the intersection of high-speed hardware engineering and strategic product management, where I:Lead Product Lifecycle (PLC) & NPI: Manage end-to-end execution for next-generation interconnect solutions, ensuring Final Sign-off (FSO) for hardware deployments in high-scale AI environments.Optimize Operational Data: Developed automated dashboards to visualize sales and production trends - increasing data accuracy by 35% and enabling real-time executive decision-making.Drive Process Efficiency: Apply Value Stream Mapping (VSM) and Lean methodologies to identify bottlenecks, reducing project lead times and optimizing resource allocation across global business units.Manage Strategic Technical Roadmaps: Collaborate with cross-functional engineering and supply chain teams to translate complex technical requirements into actionable statements of work (SOW) and RFQs.Core Capabilities:Go-To-Market (GTM) Strategy • Technical Product Management • New Product Introduction (NPI) • Value Stream Mapping (VSM) • Product Positioning & Messaging • Competitive Analysis • Resource Planning • Data Analysis & Visualization • Supply Chain Optimization • Stakeholder Management • Quality Notifications (QN) • Process Improvement (Lean)Tools:Power BI • SQL • AutoCAD • SolidWorks • SAP • Jira • Asana • Trello • Microsoft Project • Excel (Advanced VBA/Macros) • Python (Data Analysis)I’m passionate about the future of Semiconductor Equipment and AI/ML Infrastructure. Let’s connect if you’re looking for someone who can navigate deep hardware complexity and drive scalable business growth!

Experience

1. Technical Product Specialist

   Amphenol Communications Solutions

   Oct 2024 — Present · Nashua, NH, US

   Product Specialist on the High-Speed Backplane business unit of ACS- Providing Paladin HD (112G) & Paladin HD2 (224G) high-density interconnect solutions- Support tier 1 & tier 2 key customer accounts with AI/ML, Data Center & Networking applications- Drive PLM actions on supplier selection, capacity planning, production ramp & supply chain- Prepare the business case for C-level executives based on CAPEX, forecast, revenue vs ROI

Education

• St. Vincent's High School

  Grade 1-10, SSC

• MIT World Peace University

  Bachelor of Technology, Mechanical Engineering

• Northeastern University

  Master of Science - MS, Industrial Engineering