Yaoyu Pang
- Role
- Ic Packaging Simulation Engineer at Cirrus Logic
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Yaoyu Pang
10+ years Semiconductor industry front-line tactic and R&D strategic analysis -…
Experience
Ic Packaging Simulation Engineer
Oct 2017 — Present
Champion mechanical and thermal simulations using FE (finite element) and CFD (computational fluid dynamics) methods - Design and drive DOEs and analyze data to optimize mechanical and thermal design of products - Drive experiments to characterize materials for mechanical and thermal properties - Recognize opportunities and explore new technology - Keep current on simulation software improvements and alternate suppliers
Skills
- Product Development
- Oil/Gas
- Semiconductors
- Ic
- Abaqus
- Mathematica
- Fracture Mechanics
- Python
- Finite Element Analysis
- R Programming
- Simulations
- Technology Development
- Simulation
- Materials
- Mechanics of Materials
- Analog
- Product Management
- Modeling
- Subsea Engineering
- Characterization
- Data Analysis
- Petroleum
- Jmp
- Offshore
- Thin Films
- Stress Analysis
- Cmos
- Mechanical Engineering
- Packaging
- Integrated Circuits (Ic)
- Machine Learning
- Ansys
- Pipelines
- Reliability Analysis
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