Yamuna Paudel

PhD physics ( Photonics)

Role
Module Development Engineer (Advanced Packaging) at Intel
Location
Portland, OR, US
LinkedIn followers
500 followers

Experience

  1. Module Development Engineer (Advanced Packaging)

    Intel

    Jul 2025 — Present · OR, US

Education

  • tribhuvan University kathmandu,Nepal

    Master's of science in physics

    2013 — 2016

  • The Graduate Center, City University of New York

    Doctor of Philosophy - PhD

    2018 — 2024

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Yamuna Paudel — Module Development Engineer (Advanced Packaging) at Intel in Portland, OR, US | Unifers