Xi Fan
Packaging R&D Engineer | Customer Support | Process Development and Integration
- Role
- Packaging R & d Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Xi Fan
I take pleasure in improving the existing products, as well as crafting new products from…
Experience
Packaging R & d Engineer
May 2021 — Present · OR, US
Education
China U of Petroleum (Beijing)
Bachelor’s Degree
2011 — 2014
Arizona State University
Master’s Degree
2014 — 2016
Skills
- Wlcsp
- Semiconductors
- Product Design
- Leadership
- Bumping
- Data Analysis
- Project Management
- Cvd
- Research
- Plasma Etching
- Pv-Factory
- Raman
- Bulk Crystal Growth
- Xrump
- Casaxps
- Materials Science
- Doe
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