Woong-Sun Lee

제조 부사장 @SK 하이닉스

CEO of SK hynix Semiconductor West Lafayette LLC…was;Head of AP & M (Advanced PKG & Module) Technology (SVP)Supervisor of P&M(Packaging & Module) Manufacturing Technology and HBM(High Bandwidth Memory) Heterogeneous Integration Manufacturing Technology Head of WLP Technology (VP)Wafer Level Manufacturing Technology;HBM(High Bandwidth Memory),3DS-DDR5 High Density Memory,CPB(Cu Pillar Bump), RDL(Re-Distribution Layer), etc.Microelectronic Packaging Development (R&D Sr. Director)DRAM; Mobile PKG, Flip-chip, TSV 3D integration, Wafer Level PKG,Micro Bumping, Fan Out,Embedded PKG, NAND; BGA SSD, MCP, NAND Flash Controller