Willmar Subido
Looking for opportunities to provide consulting services in the area of IC package design, develop robust and cost effective microchip assembly process and tooling design both ball and wedge wire bonding process.
- Role
- Senior Process Packaging Engineer at Promex Industries Inc.
- Location
- San Francisco, CA, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Willmar Subido
Experienced Semiconductor Packaging Engineer with demonstrated skill in developing robust…
Experience
Senior Process Packaging Engineer
Mar 2017 — Present · Santa Clara, CA, US
Education
Technological University of the Philippines
Bachelor of Engineering (B.E.)
Skills
- Process Engineering
- Research and Development (R&D)
- Product Development
- Sas Jmp
- Integrated Circuits (Ic)
- Wire Bonding
- Failure Mode and Effects Analysis (Fmea)
- Failure Analysis
- Semiconductor Industry
- Semiconductors
- Electronics
- Solidworks
- Statistical Process Control (Spc)
- Design of Experiments
- Manufacturing
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