William Henstrom

Technical Manager Driving Quality and Efficiency

Role
Node Transition Project Lead at ASML
Location
Boise, ID, US
LinkedIn followers
500 followers

About William Henstrom

Previous Technical Manager with extensive experience in in logic, DRAM and NAND process…

Experience

  1. Node Transition Project Lead

    ASML

    Aug 2016 — Present · Boise, ID, US

    Led efforts to integrate ASML tools and software into Micron process nodes. This work involves finding the critical needs of the customers and then working with them and ASML Business Lines to find solutions that meet their timelines.• Awarded the ASML Project Management Gold Award for 2023 for leading a cross discipline team (both from ASML and Micron) that took Micron from no nodes using EUV and to implementing it into their production line.• Recognized both inside and outside ASML for ability to find solutions with customers through understanding of their problems and then presenting them with options that ASML can deliver.• Led communication and stakeholder management up through the Senior Executive levels on projects that directly impact Micron and ASML Business Lines.• Achieved wide use of uDBO Yieldstar tools in Micron starting with the D120s node, the first from line start uDBO implementation in Micron, the first IDM layer conversion, and first IDM layers implemented in R&D.• Led node projects in DRAM (D120s, D140s, D160s, D170s), 3DNAND (N120s, N130s, N140s), XPoint (MTX20s, MTX30s), and Emerging Memory (10s, 20s)• Influenced other NTPs across the Micron cluster as well as others in Taiwan and the TI NTP.

Education

  • Brigham Young University

    Bachelor’s Degree

  • University of Illinois at Urbana-Champaign

    Doctor of Philosophy (Ph.D.)

Skills

  • Design of Experiments
  • Manufacturing
  • Reliability
  • Strategic Communications
  • Auger Electron Spectroscopy
  • Molecular Beam Epitaxy
  • Tem Sample Prep
  • Mac Os
  • Product Development
  • Perl
  • Physics
  • Spc
  • R&D
  • Vms
  • Ham Radio
  • Research
  • C
  • Materials Science
  • Reflection Electron Microscopy (Rem)
  • Customer Service
  • Photography
  • Public Speaking
  • Strategic Planning
  • Lithography
  • Management
  • Engineering Management
  • Dcl
  • Linux
  • Windows
  • Cross-Functional Team Leadership
  • Immersion Lithography
  • Device Physics
  • Tex
  • Python
  • Latex
  • Transmission Electron Microscopy (Tem)
  • Semiconductors
  • Leadership
  • Rutherford Back-Scattering (Rbs)
  • Microsoft Office

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William Henstrom — Node Transition Project Lead at ASML in Boise, ID, US | Unifers