Wen Yin
Engineering Manager/Semiconductor Packaging/NPI/Ph. D
- Role
- Principal Engineer Manager at 高通
- Location
- San Diego, CA, US
- LinkedIn followers
- 500 followers
About Wen Yin
Sr. Manager leading new production introduction and packaging technology development.• 15 years of semiconductor development experience in semiconductor packaging, new product introduction, supplier management, quality and reliability. • Experienced engineering team manager leading multidiscipline team for new product introduction and new technology development• Strong technical background in material science with 20+ years of R&D experience with multiple publications and patents.
Experience
Principal Engineer Manager
Jan 2018 — Present · San Diego County, CA, US
Manage an engineering team to support multiple RFFE products NPI and packaging technology development.Manage RF/SIP packaging technology roadmap development, Manage OSAT/Vendor roadmap alignment and path finding projects. Oversee RFFE product from product definition to qualification.Define, develop, and qualify new packaging technology to enable RF productsDrive effort for RFFE product design for manufacture, tape out design review, package tune up, failure analysis. quality and reliability, high volume manufacture, etc.
Education
Virginia Tech
Ph.D, Polymer, Surface
2003 — 2009
Skills
- Semiconductor Process
- Six Sigma
- Cross-Functional Team Leadership
- Packaging
- Program Management
- Characterization
- Problem Solving
- Nanotechnology
- Lean Manufacturing
- Lean Six Sigma
- Design of Experiments
- Manufacturing
- Supplier Development
- Testing
- Materials Science
- Semiconductor Industry
- Product Development
- Electronics
- Supplier Management
- Engineering
- Thin Films
- Process Engineering
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