Weifeng Ye

About Weifeng Ye

Over 10-year hands-on experience in the development of module processes and BEOL/FEOL integration in semiconductor manufacture industry Project leader and key developer of 9 successful products on 3 different platforms from lab scale development to high volume production Solid understanding and well-established correlation between equipment hardware, processparameters, material properties, and device performance In-depth expertise in a wide range of thin film deposition and metrology techniques Forged capability of failure analysis and root cause investigation thru daily field issue solving Proven track record of innovation with 15 journal papers and 12 patents/patent applications Effective project management skills thru teamwork and collaborations with cross-functional teams, vendors, and customers worldwide Strong design of experiment (DOE) and statistics process control (SPC) skillst Specialties: • Process and hardware expertise in PECVD, ALD, PEALD (AMAT Producer and Endura), MBE (Veeco Gen II and Riber), FIB (FEI Nova and Quanta)• Atomic layer/monolayer film and nanostructure deposition expertise in dielectric (Si-based nitride, carbide, and oxide), metal (Cu, Co), and semiconductor materials• Surface/interface/film characterizations: FTIR, XPS, SIMS, AFM, SEM, FIB, TEM, STEM, EDX, EELS, XRD, XRF/XRR, RBS, RHEED, PL, ellipsometry, C-V, I-V, hermeticity, etc.

Experience

1. Process Engineer

   Applied Materials

   Mar 2008 — Present

Education

• University of Michigan

  MS, Materials Science and Engineering

  2001 — 2004

• University of Michigan

  PhD, Materials Science and Engineering

  2001 — 2008

• Shanghai Jiao Tong University

  BS, Materials Science and Engieering

  1997 — 2001

Skills

• Scanning Electron Microscopy
• Edx
• Sputtering
• Design of Experiments
• Ftir
• Nanotechnology
• Ellipsometry
• Device Characterization
• Focused Ion Beam (Fib)
• Physical Vapor Deposition (Pvd)
• Materials Science
• Failure Analysis
• Electron Microscopy
• Atomic Layer Deposition
• Cvd
• Semiconductors
• Tem
• Afm
• Thin Films
• Fib
• Xps
• Pecvd
• Metrology
• Silicon
• Chemical Vapor Deposition (Cvd)
• Thin Film Characterization
• Materials
• Plasma-Enhanced Chemical Vapor Deposition (Pecvd)
• Photolithography
• Pvd
• Etching
• Powder X-Ray Diffraction
• Characterization
• Physics