Venkata Krishna Adabala

Packaging R&D Engineer@Intel | Process & Product Development | MSME Grad@PURDUE

Role
Packaging R & d Engineer at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Venkata Krishna Adabala

Welcome to my LinkedIn profile!I\'m Venkata Krishna Adabala, a results-oriented Mechanical Engineer with a deep commitment to problem-solving and continuous growth. With a Master\'s degree in Mechanical Engineering, specializing in Heat Transfer from Purdue University, and a Bachelor\'s degree in Mechanical Engineering from Jawaharlal Nehru Technological University in India, I\'ve cultivated a strong academic foundation. Skills & Expertise:CAD: SOLIDWORKS, UG NX, CATIA V5, CREO, AutoCAD, Fusion 360CAE: ANSYS Fluent, Mechanical, APDL, Workbench, COMSOL MultiphysicsLanguages: C, C++, Python, R, MATLAB, Simulink, SQL, LabVIEWManufacturing Design: Injection Molding, Sheet Metal, Die Casting, CNC Machining, 3D PrintingKey Skills: DFM, DFA, FMEA, Hypothesis testing, DOE, SPC, GD & T, PPAP, Gage R&R, PLM, Root Cause Analysis, 8D, 5-Why, Fishbone, PLC Programming, NI DAQ, Agile Project Management, Leadership, Team building, Machine Learning, Data Analysis, Testing Work Experience:I\'ve had the privilege of working in diverse roles, including: Student Data Analyst at DCMME Laboratory, Purdue University, where I conducted in-depth data analysis, leveraged regression analysis and data mining algorithms, and led strategic decision-making using data-driven insights. Mechanical Engineer Intern at APGENCO, contributing to turbine blade design, DFM/DFA analysis, and structural and thermal FE simulations. Mechanical Design Engineer Intern at B.H.E.L, where I developed 3D models and CAD drawings, spearheaded tolerance stack-up analyses, and applied statistical process control to ensure product and process quality. Connect with Me:I\'m enthusiastic about collaborating with fellow professionals, industry experts, and like-minded individuals. Let\'s connect and explore opportunities for growth, innovation, and problem-solving together. Contact:You can reach me at or via email at k••••••••@gmail.com. Connect with me on LinkedIn to stay updated on my professional journey.Let\'s connect, collaborate, and make a positive impact together! 🤝

Experience

  1. Packaging R & d Engineer

    Intel

    Jan 2024 — Present · Hillsboro, OR, US

Education

  • Jawaharlal Nehru Technological University

    Bachelor of Technology - BTech, Mechanical Engineering

  • Purdue University College of Engineering

    Master of Science - MS, Mechanical Engineering

  • Bhashyam College of Education

    Secondary School Certification

  • Sri Chaitanya College of Education

    High School Diploma

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Venkata Krishna Adabala — Packaging R & d Engineer at Intel in Hillsboro, OR, US | Unifers