Vivek Saraswat

Materials & Process Integration Engineer, Intel 14A | University of Wisconsin-Madison | University of Cambridge | IIT-Bombay

Role
Senior Process Integration Engineer at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Vivek Saraswat

Semiconductor professional with 5+ years of experience in process integration, yield…

Experience

  1. Senior Process Integration Engineer

    Intel

    Dec 2020 — Present · Hillsboro, OR, US

    Spearheaded the execution of a strategic roadmap to reduce defects and drive performance improvement for Intel 4 and Intel 3 interconnect backend layers, while regularly briefing key leadership stakeholders on overall progress and impact – Drove cross-functional collaborations between various process, metrology, device, reliability and yield teams to achieve 100x reduction in defect density, resulting in 7 Divisional Awards – Twice awarded the Intel’s Distinguished Invention Award for contributions to development of a novel etch process that yielded $100 million in equipment savings and development of a quick turn monitor for improved inline detection of sub-10 nm defects – Mentored new engineers and coordinated the HVM transfer of Intel 4 and Intel 3 process nodes to Fab 34, Ireland – Leading the development and implementation of process flow for integrating Hi-NA EUV lithography in the backend interconnect patterning for the Intel 10A process technology

Education

  • Indian Institute of Technology, Bombay

    Bachelor of Technology (B.Tech.), Metallurgical Engineering and Materials Science, Management

    2010 — 2014

  • University of Cambridge

    Master of Philosophy (M.Phil.), Micro- and Nanotechnology Enterprise

    2014 — 2015

  • University of Wisconsin-Madison

    Doctor of Philosophy (Ph.D.), Materials Science and Engineering

    2015 — 2020

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Vivek Saraswat — Senior Process Integration Engineer at Intel in Hillsboro, OR, US | Unifers