Vivek Kamble
Senior Signal Integrity Engineer, NVIDIA| Ex-AMD, ANSYS, DRDO
- Role
- Senior Signal and Power Integrity Engineer at NVIDIA
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Vivek Kamble
Vivek is a Senior Signal and Power Integrity Engineer at NVIDIA in Austin, Texas, with over five years of experience in RF, electromagnetic (EM), signal integrity (SI), and power integrity (PI) simulation and measurement. At NVIDIA, he focuses on high-speed design, SI/PI analysis, and electromagnetic extraction for advanced computing systems, with a particular emphasis on developing and optimizing NVLink interconnects. Vivek leverages extensive expertise in electromagnetic modeling and high-speed digital design to innovate robust solutions for next-generation data and AI platforms.Before NVIDIA, Vivek held SI roles at AMD, where he performed system-level SI simulations for high-speed links such as USB-4 and PCIe 5.0, conducted 3D EM modeling, and performed board and package-level analysis. He has also served as a Technical Support Engineer at Ansys, Inc, providing expert consulting and developing educational resources for electromagnetic simulation tools. Vivek’s foundation was built in academia, where he taught and mentored in electromagnetic theory, antenna design, and microwave engineering.He holds an M.S. in Electrical Engineering from the University of Colorado Boulder, an M.Tech. in RF & Microwave Antenna Design from DIAT, and a B.E. in Electronics and Telecommunications Engineering. Vivek is certified in advanced signal and power integrity methods and has received the MHRD Scholarship and the Mahatma Jotiba Phule National Research Fellowship. He remains dedicated to advancing RF, SI/PI, and high-speed digital design—especially through his impactful work on NVLink technology
Experience
Senior Signal and Power Integrity Engineer
Jan 2024 — Present · Austin, TX, US
Delivered innovative Signal Integrity (SI) solutions that enhanced performance and reliability in complex high-speed system designs- Modeled and optimized vias, connectors, sockets, and breakout structures using 3D electromagnetic (EM) tools, which reduced channel loss and improved performance margins- Conducted system-level SI simulations for NVLink 200 Gbps, USB4, PCIe 5.0, GDDR6, and LPDDR5X interfaces, facilitating successful sign-off for next-generation products- Improved SI models by correlating simulation results with laboratory measurements, resulting in increased model accuracy and fewer debugging cycles- Developed and reviewed substrate and PCB SI design guidelines, contributing to higher layout quality and first-pass success- Collaborated with packaging, PCB, ASIC, and mixed-signal teams to optimize overall system performance and achieve product-level targets.
Education
Nagpur University
Bachelor of Engineering (BE), Electronics and Telecommunications Engineering
University of Colorado Boulder
Master of Science - MS , Electrical Engineering, High Speed Digital Design, Signal and Power Integrity, RF, Electromagnetics ,
Defence Institute of Advanced Technology (DIAT), DU, DRDO
Master of Technology - MTech, RF, Microwave Antenna design
Skills
- Ajax
- C
- Html
- Servlets
- Openstack
- C++
- Swift
- C#
- Mongodb
- Sql
- Linux
- Java Enterprise Edition
- Hibernate
- Maven
- Javascript
- Openstack Compute
- Jsp
- Css
- Java
- Core Java
- Jenkins
- Xml
- Microsoft Sql Server
- Spring Framework
- Mysql
- Cloud Computing
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