Vivek Pawar
R&D Packaging Engineer - Thermal Analyst
- Role
- Semiconductor Packaging Engineer - Thermal Engineer at NXP Semiconductors
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Vivek Pawar
A dynamic, innovative, performance-driven, and highly motivated CFD engineer with more than 4 years of experience in fluid dynamics, heat transfer, thermal energy storage system design, and analysis. Excellent problem solver with effective management and leadership qualities. Seeking an internship position in the field of research and development to utilize strong technical skills and professional experience.
Experience
Semiconductor Packaging Engineer - Thermal Engineer
Sep 2022 — Present · Austin, TX, US
Education
Gannon University
Master of Science (MS), Mechanical Engineering
2016
University of Missouri-Kansas City
Doctor of Philosophy - PhD
Sigma Institute of Technology & Engg.( Polytechnic) 648
Diploma In Mechanical Engineering, Mechanical Engineering
2009 — 2012
ITM (Gujarat Technology University)
Bachelor of Engineering (B.E.), Mechanical Engineering
2012 — 2015
Skills
- Autocad
- Ansys
- 5s
- Manufacturing
- Microsoft Office
- Autodesk Inventor
- Asme Y14.5
- Powerpoint
- Microsoft Excel
- Kaizen
- Ptc Creo
- Pro Engineer
- Engineering
- Stress Analysis
- Geometric Dimensioning & Tolerancing
- Six Sigma
- C++
- Mechanical Engineering
- Product Development
- Hvac
- Minitab
- Team Management
- Finite Element Analysis
- Cae
- Solidworks
- Matlab
- Cad
- Computational Fluid Dynamics (Cfd)
- Cfd
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