Vishnu Shukla
Process Engineer 3 @Lam Research
Portland, OR, US
EMAILS
MOBILE NUMBERS
+91 *********19
Signup · Get unlimited contacts
WORK HISTORY
Apr 2025 — Present
Process Engineer 3 @Lam Research
View department →
Tualatin, OR, US
Responsible for process developments in wafer level packaging with a focus on electroplating of microbumps, megapillars and RDLs.
ABOUT VISHNU SHUKLA
Advanced Packaging - Sabre 3D
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.