Vishal Subramanya
- Role
- Ic Package Layout Design Engineer at Micron Technology
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
Experience
Ic Package Layout Design Engineer
May 2024 — Present
Currently engaged in advanced IC package layout design, specializing in both complex wire bond and flip-chip architectures. Demonstrated expertise in Signal Integrity (SI), Power Integrity (PI), and Power Delivery Network (PDN) optimization. Proven track record in developing high-performance, manufacturable package solutions for cutting-edge memory and logic technologies, including GDDR, LPDDR, DDR, DRAM, NAND, and MNAND.Skilled in designing packages across a range of BGA formats—from standard to fine-pitch and ultra-fine-pitch BGAs, includingultra-fine-pitch BGA for high-density interconnectsPoP (Package-on-Package) configurationsExperienced in managing the challenges of high pin counts, tight spacing, and advanced stacking technologies to support next-generation applications.
Education
UVCE
Bachelor of Technology - BTech, Electrical, Electronic and Communications Engineering Technology/Technician
Government polytechnic harihar
High School Diploma, Electrical, Electronics and Communications Engineering
2015 — 2018
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