Vishal Saroha

Technology and Market Analyst @Yole Group

Berlin, DE
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+91 *********19

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WORK HISTORY

Mar 2023 — Present

Technology and Market Analyst @Yole Group

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Berlin, DE

Working as a Technology and Market Analyst focusing on semiconductor Back End Equipment with a strong link to advanced packaging. I started as a packaging analyst and I keep that focus while covering equipment. My scope covers equipment related to Hybrid Bonding, TCB, Flip chip/Die attach, Wire Bonding, Wafer Thinning & Dicing, Metrology & Inspection and related Back End Equipment. I track 2.5D and 3D packaging, chiplets, HBM, fan out, chip on wafer and wafer on wafer, and broader heterogeneous integration to translate technology moves into tool demand and timing. I support end markets in HPC and AI, data center, mobile and consumer, industrial and automotive.Tasks and activities• Build bottom up market models with units and ASPs, vendor shares, and multi year forecasts. Cross check with interviews, financial data, and shipment trackers.• Run voice of customer programs with IDMs, foundries, OSATs, and equipment suppliers. Maintain an expert network.• Track technology inflections like fine pitch hybrid bonding and HBM driven 2.5D and 3D. Translate them into tool demand and timing.• Deliver custom consulting. Commercial due diligence. Market entry and growth strategy. Product and price positioning. Competitive benchmarking. TAM, SAM, SOM sizing. Scenario planning and sensitivity analysis.• Create executive ready reports, models, and dashboards. Present insights in client briefings, webinars, and at prominent industry events like Semicon.• Write industry articles. Coordinate with editors and event teams to publish and present on time.Selected publications and talks• Advanced packaging fuels growth in the back end equipment market — Semiconductor Digest (Semicon West ShowDaily, 2025).• “Besi and ASMPT still far ahead in ever crowdier hybrid bonding market” — Bits & Chips (2025).• “Quick adoption of hybrid bonding with an entry at 10 µm pitches” — Bits & Chips (2024).• Invited speaker at events SEMI 3D & Systems Summit, SEMICON Southeast Asia, Photomask Japan

EDUCATION

2015 — 2018

KU Leuven

Master’s Degree, Nanotechnology

2016 — 2016

INSTITUT MINES TELECOM - Télécom ParisTech

Exchange during Masters, Quantum Entanglement for Communications : from Theory to Experiments

1998 — 2011

St. Mary's Academy, Meerut Cantt.

Physics, Chemistry, Mathematics with Computer Science. Proficient in JAVA in BlueJ environment.

2011 — 2014

Delhi University

Bachelor's degree, Physics

2017 — 2017

Universidad Politécnica de Madrid

Exchange during Masters, Neurophotonics of Vision

SKILLS

ElectronicsMicrosoft WordSensorsCreativity SkillsJavaPhysicsSemiconductor LasersResearchQuantum MechanicsPublic SpeakingSemiconductor Process TechnologyNumerical AnalysisPowerpointMicrosoft ExcelCommunicationSocial MediaSuperconductorsNemsSemiconductor PackagingSemiconductor FabricationMemsMicrosoft OfficeSpintronicsC++EnglishTeamworkTeam ManagementMatlabApplied MathematicsLeadershipSemiconductor DeviceSemiconductor IndustrySemiconductor Failure AnalysisCFinite Element AnalysisScienceNanotechnologyOpticsPhotonicsDevice Characterization

ABOUT VISHAL SAROHA

Passionate about nanotechnology and semiconductor advancements. Experienced as a Process Integration Engineer and now specializing in strategic analysis of semiconductor technologies and markets. Nanotechnology graduate from KU Leuven, specializing in semiconductors. Former Device Targeting Engineer at GlobalFoundries, Dresden, specializing on their 22FDX platform. Currently a Technology & Market Analyst at Yole Group, focusing on strategic analysis of semiconductor markets, supply chain dynamics, and technological developments.I bring a strong technical background, coupled with keen market insight, to analyze the rapidly evolving semiconductor industry. My expertise lies in assessing market trends, technological developments, identifying growth opportunities, and providing strategic recommendations to industry stakeholders.As a Technology and Market Analyst at Yole Group, I cover semiconductor Back End Equipment with a strong link to advanced packaging (2.5D/3D, chiplets, HBM). I focus on equipment related to Hybrid Bonding, TCB, Die Attach/Flip‑Chip, Wafer Thinning & Dicing, Wire bonding, Metrology & Inspection, etc. I build top-down and bottom up market models and forecasts. I run voice of customer interviews across IDMs, foundries, OSATs, and tool vendors. I deliver custom consulting that includes commercial due diligence, market entry, competitive benchmarking, and TAM & SAM sizing. I write industry articles and present at conferences. My goal is clear insights that support decisions for vendors and investors.What I enjoy most: turning messy market signals into clear, defensible insights that support high‑stakes decisions.Let\'s connect to explore collaborations, discuss industry insights, and contribute to the exciting world of semiconductor technology.

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Vishal Saroha — Technology and Market Analyst at Yole Group in Berlin, DE | Unifers