Vinothkanna Chockanathan
Advanced Packaging Professional | Specializing in Wafer-Level, Fanout WLP, TSV, 3DIC, SiP, & BGA Solutions
- Role
- Staff Engineer, Packaging Engineering at Sandisk
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
About Vinothkanna Chockanathan
With over 14 years of extensive experience in the semiconductor industry, I bring a wealth of expertise to the table. Holding a Master\'s degree in Microelectronics, my proficiency encompasses diverse areas such as semiconductor packaging, process development, Research, NPI, and production sustaining. My contributions extend beyond the workplace, as evidenced by the numerous papers I have authored/co-authored for international conferences and journals, along with my involvement in the creation of valuable know-how and patents. Keenly attuned to the pulse of the semiconductor landscape, I am well-versed in the latest industry trends and hold a particular interest in microLED technology.
Experience
Staff Engineer, Packaging Engineering
May 2023 — Present · Bangalore, IN
Semiconductor memory packaging
Education
Technical University of Munich
Master of Science - MS
Nanyang Technological University Singapore
MS
Jayaram College of Engineering and Technology
BE
Skills
- Failure Mode and Effects Analysis (Fmea)
- Engineering
- Process Simulation
- Ic
- Laser
- Warpage Control
- Spc
- Jmp
- Physical Vapor Deposition (Pvd)
- Ewlb
- Semiconductor Industry
- Materials
- Balldrop
- Electronics
- Semiconductor Process
- Research and Development (R&D)
- Design of Experiments
- Ap Spec
- Contact Resistance
- Semiconductors
- Doe
- Plating
- Solder Ball Drop
- Simulations
- Process Development
- 3dic Ewlb
- Semiconductor Fabrication
- Rf Mems
- Statistical Process Control (Spc)
- Process Integration
- Photolithography
- Leakage Test
- Product Development
- Process Control
- Mems
- Backgrind
- 3dic
- Tsv
- Dryfilm
- Fmea
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