Vinit Kumar Choudhary

About Vinit Kumar Choudhary

Currently serving as Engineering Manager at Interface Microsystems, leading engineering execution with a strong focus on automotive systems and mechatronics integration. Driving technical roadmaps, product ownership, and cross-functional collaboration across hardware, supply chain, and validation to deliver robust, production-ready electronic systems. Experienced in managing global stakeholders and ensuring on-time, high-quality program delivery.With 17+ years of experience across mechanical design and system-level product development, I specialize in instrument clusters and ECU/BCM architectures, with growing expertise in electronics packaging including PCB integration, thermal management, EMI/EMC considerations, and connector/harness design. My background spans plastics, die casting, and DFM/DFA, enabling a strong bridge between mechanical design and electronic system requirements.Passionate about building high-performing teams, I focus on mentoring engineers, fostering ownership, and driving innovation that balances performance, manufacturability, and reliability. I thrive in environments that demand end-to-end system thinking, cross-domain integration, and scalable engineering solutions aligned with business goals.

Experience

1. Engineering Manager

   Interface Microsystems

   Dec 2025 — Present · Gurugram, IN

   Lead end-to-end development of automotive electronic systems including ECU/BCM and other modules with ownership of mechanical architecture and system integrationDrive mechatronics integration across PCB, housing, connectors, and thermal paths to ensure performance, reliability, and complianceManage cross-functional teams across hardware, validation, supply chain, and manufacturing, ensuring seamless execution from concept to SOPImplement DFM/DFA strategies for plastics and die-cast components, improving manufacturability, cost, and first-pass yield Lead thermal management and electronics packaging design, ensuring durability under automotive environmental conditionsIntegrate EMI/EMC considerations into enclosure and system design to meet compliance and reduce field risks Collaborate with OEM customers and global stakeholders to deliver cost-effective, compliant, and competitive solutions Mentor and develop engineers, fostering a culture of ownership, accountability, and continuous improvement

Education

• Central Institute Of plastics Engineering And Technology

  PD-PMT, Plastics Mould Design And Product Design

  2004 — 2008

• Birla Institute of Technology and Science, Pilani

  BS IN ENGINEERING TECHNOLOGY, Manufacturing Engineering

  2013 — 2016

• Purnea College

  12 th, Science

  2002 — 2004

• D.SCHOOL

  10th, Science, Maths

  2000 — 2002