Vaishnav Srinivas

About Vaishnav Srinivas

With over 22 years in semiconductor hardware circuit and system design, my experience and…

Experience

1. Senior Director of Engineering

   高通

   Nov 2002 — Present

   Electrical Systems Engineering Lead for all of Qualcomm products, covering: Component and Interface Systems- Roadmapping, architecture exploration for high-speed and low-speed interfaces, including system specification for all interfaces- Chiplet exploration and circuit-system co-design for 2.5D/3D, including D2D/C2C specification- Memory System Design and Architecture - Standard and custom component definition, lifecycle management and exploration with component vendors, including DRAM, Flash and other components. Includes JEDEC spec alignment- System validation for components and interfaces, including pre-silicon and post-silicon. HW/SW optimization, system validation and post-silicon debug for high-speed interfaces and 3rd party components. Signal and Power Integrity- Signal and power integrity for high-speed interfaces for all of Qualcomm products- 2.5D/3D interface SIPI exploration and design PDN Design and Signoff - PDN design and signoff for CPU/GPU/Modem and SOC/PKG/PCB signoff. PDN methodology and mitigation techniques- Responsible for overall PDN design, methodology and analysis for whole SOC/PKG/PCB. Involves methods on-die and off-die to reduce voltage droops using a combination of design, technology and floorplanning techniques- PDN exploration techniques for upfront correct by construction of the PDN.

Skills

• Signaling Protocols
• C
• Memory Architecture
• Power Integrity
• Matlab
• Spice
• Computer Architecture
• Semiconductor Process Technology
• Cadence Virtuoso
• Synchronization
• Circuit Design
• Cadence Analog Artist
• Verilog
• Technology Roadmapping
• Ddr Phy Design
• I/O Circuit Design
• Signal Integrity