Ugapriya Thirugnanam

Vice President Engineering Partnerships Vendor Program Office @Goldman Sachs

Toronto, ON, CA
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Mar 2022 — Present

Vice President Engineering Partnerships Vendor Program Office @Goldman Sachs

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Toronto, ON, CA

EDUCATION

N/A

Bharathiar University

Bachelor of Science (B.Sc.)

N/A

Alagappa University, Alagappa Nagar, Karaikudi

Master of Business Administration - MBA

ABOUT UGAPRIYA THIRUGNANAM

I design processes and workflows that intelligently improve the business environment, with a tenacious eye on customer service, cost control and quality. I embrace complexity, as that always leads to the most elegant solutions. I always look for opportunities that allow me to innovate, improve and implement meaningful change. Currently leading Process Engineering and Technical Writing team for Consumer banking across Marcus and Goldman Sachs Credit CardSpecialities:• Business process reengineering• Business Process modelling BPMN 2.0 (Signavio)• Workflow Automation Design• Strategy and operations• Business Activity Monitoring• Process Intelligence• Lean & SixSigma applications• Architecture Governance• Workflow Automation• Client Relationship Management• Project Planning• Process (Re)engineering• KPI Development • Training Management• Consumer Privacy • Fraud Prevention• Mentoring and Leadership

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Ugapriya Thirugnanam — Vice President Engineering Partnerships Vendor Program Office at Goldman Sachs in Toronto, ON, CA | Unifers