Tyler Osborn
Director of Wafer Assembly Technology Development at Intel Corporation
- Role
- Director of Wafer Assembly Technology Development at Intel
- Location
- Portland, OR, US
- LinkedIn followers
- 500 followers
About Tyler Osborn
Senior experienced process development engineer and department manager focused on…
Experience
Director of Wafer Assembly Technology Development
Apr 2021 — Present · Hillsboro, OR, US
Education
University of California, Berkeley
B.S.
2003 — 2005
Las Positas College
Chemical Engineering
2000 — 2003
Georgia Institute of Technology
Ph. D
2005 — 2009
Skills
- Process Integration
- Technical Presentations
- Equipment Development
- Microelectronics
- Cvd
- Materials
- Semiconductor Packaging
- Thin Films
- Cross-Functional Team Leadership
- R&D
- Spc
- Semiconductors
- Advanced Packaging Design/Process/Materials Interactions
- Statistical Process Control (Spc)
- Engineering Management
- Photolithography
- Influence Others
- Metrology
- Statistics
- Jmp
- Opto-Electronic Device Packaging
- Design of Experiments
- Manufacturing
- Project Management
- Technical Leadership
- Characterization
- Process Engineering
- Materials Science
- Failure Analysis
- Semiconductor Industry
- Process Development
- Process Simulation
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