Trina Ghoshdastidar
Ex-Intel/Tesla/Sandisk | Inventor I Advanced Packaging | AI/Data-Center Hardware Architectures | Data Center Cooling I Cornell PhD
- Role
- Packaging Technical Leader, Silicon Photonics at Cisco
- Location
- Fremont, CA, US
- LinkedIn followers
- 500 followers
About Trina Ghoshdastidar
My work focuses on enabling next-generation data-center and AI workloads through scalable packaging strategies spanning materials, silicon interfaces, substrates and thermal management considerations.I shape advanced packaging architectures for 2.5D and 3D integration, with experience navigating materials, manufacturing, and thermal constraints at scale across high-capacity SSD storage, data-center cooling, and power electronics.I lead cross-disciplinary alignment to translate packaging, thermal, manufacturing, and materials building blocks into solutions that scale to high-volume deployment.I am passionate about understanding tradeoffs and developing innovative solutions that bridge gaps across disciplines and constraints.Notable programs: Intel RealSense (optical assembly), Skylake (substrate certification),Kaby Lake‑G (EMIB), Optane (air cooling/TIM), Aurora Supercomputer ( liquid cooling), Tesla Megapack (power-electronics assembly)
Experience
Packaging Technical Leader, Silicon Photonics
Apr 2026 — Present · San Jose, CA, US
Education
Cornell University
PhD, Material Science and engineering
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