Tracy Tennant
Design Technology Integration @Micron Technology
Boise, ID, US
EMAILS
MOBILE NUMBERS
+12•••••••74
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WORK HISTORY
Mar 1988 — Present
Design Technology Integration @Micron Technology
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Boise, ID, US
Package Characterization, CPI, PFA, Reliability, and Materials Engineering
SKILLS
ElectronicsDmaicContinuous ImprovementMetrologyQuality AssuranceSmtFmeaRoot Cause AnalysisEngineering ManagementSix SigmaReliabilityIsoJmpDramSpcFailure AnalysisCapaSemiconductor IndustryTestingProduct EngineeringQuality SystemProcess SimulationDesign of ExperimentsManufacturingQuality ManagementSupplier QualityProcess Engineering
ABOUT TRACY TENNANT
Director - Semiconductor Package Development Engineering
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