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Tingfang Ji

Global Head of 6G Research at Qualcomm

Role
Vice President of Engineering at 高通
Location
San Diego, CA, US
LinkedIn followers
500 followers
EngineeringView LinkedIn profile

Experience

  1. Vice President of Engineering

    高通

    Nov 2021 — Present

Education

  • University of Michigan

    PhD, Electrical Engineering

    1997 — 2001

  • Tsinghua University

    B. E., Electronic Engineering

    1990 — 1995

Skills

  • Wireless Technologies
  • Radio Frequency (Rf)
  • Lte
  • Algorithms
  • Mobile Devices
  • Telecommunications
  • Embedded Systems
  • Signal Processing
  • Nr

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Tingfang Ji — Vice President of Engineering at 高通 in San Diego, CA, US | Unifers