Tian Qiu
IC Packaging Design Lead at Google
- Role
- Ic Packaging Design Lead at Google
- Location
- Sunnyvale, CA, US
- LinkedIn followers
- 500 followers
About Tian Qiu
Electrical Engineering background in VLSI, IC Packaging, PCB and Antenna Design: Advanced Packaging technology design and development; Product/platform planning and integration; System-level Signal Integrity/Power Integrity performance analysis; Electromagnetic Field, Antenna design on package substrate; Analog/RF integrated circuit design and testing; IC package assembly and substrate manufacturing technologies; Project management skills and ability to work in cross-functional team.
Experience
Ic Packaging Design Lead
Jun 2021 — Present · Sunnyvale, CA, US
Education
Xidian University
Bachelor's degree, Electrical and Electronics Engineering
2008 — 2012
University of Pennsylvania
Master's degree, Electrical and Electronics Engineering
2012 — 2014
Skills
- Ic Packaging Design
- Power Delivery
- Simulations
- Ic Packaging
- Hfss
- Data Analysis
- Verilog
- Matlab
- Allegro
- Semiconductors
- Python
- Photoshop
- Mentor Graphics
- C
- Signal Integrity
- Microsoft Office
- Cadence Virtuoso
- Agilent Ads
- Cadence
- Mentor
- Apd
- Cadence Schematic Capture
- Antenna Design
- Integrated Circuit Design
- Pcb Design
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