Tegan Campbell
Engineering Director at Western Digital
- Role
- Product Development Team Lead at WD
- Location
- Irvine, CA, US
- LinkedIn followers
- 500 followers
Sales & Business DevelopmentView LinkedIn profile
About Tegan Campbell
Expert in the complete \'ecosystem\' of product design - from architecture through design…
Experience
Product Development Team Lead
Mar 2020 — Present
Education
Bucknell University
Bachelor of Science (BS), Electrical and Electronics Engineering
1995 — 1999
Skills
- Integrated Circuit Design
- Microprocessors
- Failure Analysis
- Soc
- Firmware
- Simulations
- Processors
- Analog Circuit Design
- Semiconductors
- Ssd
- Ic
- Schematic Capture
- Electronics
- Spc4
- Fpga
- Embedded Software
- Asic
- Ic Packaging
- Embedded Systems
- Debugging
- Hardware Architecture
- Field-Programmable Gate Arrays (Fpga)
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