Ted Adlam
Sr. Director System-in-Package Product Line at Amkor Technology
- Role
- Vice President, System in Package Product Line at Amkor Technology, Inc.
- Location
- Payson, AZ, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Vice President, System in Package Product Line
Mar 2023 — Present · Tempe, AZ, US
Education
Indiana University Bloomington
BA
1979 — 1982
Rensselaer Polytechnic Institute
Chemistry
1982 — 1983
W. P. Carey School of Business – Arizona State University
MBA
1991 — 1993
Skills
- Semiconductor Packaging
- Electronics Packaging
- Yield
- Design of Experiments
- Manufacturing
- Product Development
- Product Engineering
- Semiconductors
- Engineering
- Microelectronics
- R&D
- Spc
- Pcb Design
- Ic
- Failure Analysis
- Semiconductor Industry
- Fmea
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.