Tara Pandey
Packaging CMP R&D Engineer at Intel Corporation
- Role
- Packaging Cmp Research and Development Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Packaging Cmp Research and Development Engineer
Sep 2021 — Present · Hillsboro, OR, US
Education
Colorado School of Mines
Doctor of Philosophy (Ph.D.), Chemical Engineering
2011 — 2016
Brigham Young University
Bachelor of Science (B.S.), Chemical Engineering
2007 — 2011
National Institute of Science and Techology
High School, Biological Sciences, Physics, Chemistry, Mathematics
2003 — 2005
Skills
- Labview
- Chemical Engineering
- Fluorescence Microscopy
- Electrochemical Characterization
- Mathcad
- Polymer Chemistry
- Experimentation
- Design of Experiments
- Physics
- Leadership
- Engineering
- Statistics
- Electrochemistry
- Research
- Matlab
- Powder X-Ray Diffraction
- Ftir
- Heat Transfer
- Polymers
- Ni Labview
- Mathematica
- Scanning Electron Microscopy
- Aspen Plus
- Fluid Mechanics
- Thermodynamics
- Tem
- Afm
- Microsoft Office
- Data Analysis
- Confocal Microscopy
- Chemistry
- Polymer Characterization
- Minitab
- Solidworks
- Polymer Science
- Designs of Experiments
- Characterization
- Reaction Engineering
- Spectroscopy
- Microscopy
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.