Tanmay Padhye

Mechanical Engineer | Process Engineer | Product Development Engineer| Purdue M.S.M.E

Role
Senior Advanced Packaging Process Engineer at Intel
Location
Beaverton, OR, US
LinkedIn followers
500 followers

About Tanmay Padhye

I\'m actively looking for full-time opportunities in the areas of Mechanical or Industrial Engineering. I wish to apply my strong technical aptitude and analytical mindset to help organizations innovate and solve complex world problems. I am a Mechanical Engineer with a professional experience of over 6 years in product development, process improvement, sustaining and application engineering. I graduated with a master’s degree in Mechanical Engineering from Purdue University with a focus on design and manufacturing. QUALIFICATIONS• Experience in all stages of the product design cycle from concept to launch• Experienced in 3-D CAD software (CATIA V5, CREO Elements, SolidWorks)• Created and interpreted CAE simulations to optimize product designs• Strong understanding of GD & T, DFM and DFA principles• Lean Six Sigma Yellow Belt Certified • Experienced in Product Data Management (PDM) – Windchill• Project milestones and budget planning • Knowledge of the development of specifications, DFMEAs and test plans • Proficient in Microsoft Suites: Excel, Word and Power Point• Manage and collaborate with key suppliers to support overall product development • Strong understanding of statistical analysis tools to make data-driven decisionsEXPERIENCE• Produced complex 3-D solid models • Knowledgeable in jig & fixture design• Experience in FEA and CFD simulations• Knowledgeable in engineering materials • Experience leading continuous improvement projects• Knowledgeable in mechanical properties such as: stress, strain, yield strength, tensile strength, shear stress, hardness• Knowledgeable in manufacturing processes such as: machining, injection molding, stamping, welding• Experience in creating and resolving ECR/ECOs • Supported internal and external audit activities • Supported non-conformance investigations and dispositions• Conducted mechanical performance inspections at supplier\'s facility• Collaborated with operations, manufacturing, supply chain to ensure quality standards are in place.SOFTWARE/TECHNICAL TOOLS:• 3D Modeling: CATIA, Pro-E Creo Elements, SolidWorks, AutoCAD• CAE Software: ANSYS Workbench, ANSYS Fluent, SpaceClaim, CFD Post • Simulation Software: CarSim, Simulink (Simscape), Lotus Suspension Analysis• Computational/Statistical Software: MATLAB, Minitab, JMP• Data Visualization Tools: Power BI, Tableau, MS Excel • Programming Software: C++, Python, Arduino, PLC• Quality Tools: Control Charts, DMAIC, DFSS, SPC, DFMEA, DOE, 5S, PPAP, APQPFeel free to contact me on t••••••••@gmail.com for further details.

Experience

  1. Senior Advanced Packaging Process Engineer

    Intel

    Oct 2020 — Present · Hillsboro, OR, US

Education

  • Purdue University

    Masters, Mechanical Engineering

    2017 — 2019

  • Sardar Patel College of Engineering (SPCE),Mumbai

    Bachelor of Technology (B.Tech.), Mechanical Engineering

    2011 — 2015

Skills

  • Microsoft Office
  • Modern Control Theory
  • Inspection and Testing
  • Customer Relationship Management (Crm)
  • Classical Control Theory
  • Control Systems Design
  • Microsoft Excel
  • Ansys
  • Autocad
  • Problem Solving
  • Fluid Power Systems
  • Microsoft Word
  • Leadership
  • Ms-Office
  • Feedback Control Systems
  • Microsoft Powerpoint
  • Simulations
  • Team Building
  • Carsim
  • Epc/Epcm
  • C++
  • Mechanical Engineering
  • Simulink
  • Ptc Creo
  • Finite Element Analysis
  • Engineering
  • Lotus Suspension Analysis
  • Hydraulics
  • Rotating Equipment
  • Catia
  • Vehicle Dynamics
  • Matlab

Find verified contacts for anyone on LinkedIn

Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.

Free plan included · No credit card required

This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.

Tanmay Padhye — Senior Advanced Packaging Process Engineer at Intel in Beaverton, OR, US | Unifers