Tali Eylat
Process Engineer at Intel
- Role
- Advanced Packaging Process Engineer and E3 Program Leader at Intel
- Location
- Albuquerque, NM, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Tali Eylat
Experienced process engineer in advanced packaging and wet etch processes on multiple…
Experience
Advanced Packaging Process Engineer and E3 Program Leader
Jul 2024 — Present · Albuquerque, NM, US
Education
The Hebrew University
Master’s Degree
2008 — 2010
The Hebrew University
Bachelor’s Degree
2005 — 2008
Skills
- Uv/Vis Spectroscopy
- Uv-Vis
- Uv/Vis
- Assay Development
- Hplc
- Quantum Dots
- Western Blotting
- Ftir
- Nanoparticles
- Employee Training
- Wood Chemistry
- Nanotechnology
- Chemistry
- Gel Electrophoresis
- Research
- Life Sciences
- Protocol Development
- Cell Biology
- Organic Synthesis
- Biotechnology
- Research and Development (R&D)
- Science
- Biochemistry
- Dna
- Cell
- Protein Chemistry
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