Sushrutha Reddy Gujjula
- Role
- Packaging R & d Engineer at Intel Corporation at Intel
- Location
- Chandler, AZ, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Sushrutha Reddy Gujjula
Mechanical engineer with 3.5 years’ experience in designing, modeling, simulations…
Experience
Packaging R & d Engineer at Intel Corporation
Aug 2015 — Present
Education
University of Cincinnati
Master's Degree, Computational Fluid Dynamics
2011 — 2015
Skills
- Gambit
- Autocad
- Microsoft Office
- Computational Fluid Dynamics
- Numerical Analysis
- Microsoft Excel
- Teaching
- Ansys Fluent
- C++
- Java
- Ansys
- Openfoam
- Python
- Research
- Statistics
- Matlab
- Cfd
- Simulations
- Data Analysis
- C
- Solidworks
- Ensight
- Ansys Workbench
- Heat Transfer
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